This isn’t Sci-Fi, but Feynman’s 1959 talk *There’s Plenty of Room at the Bottom *predicts large-scale integrated circuits:
*How can we make such a device? What kind of manufacturing processes would we use? One possibility we might consider, since we have talked about writing by putting atoms down in a certain arrangement, would be to evaporate the material, then evaporate the insulator next to it. Then, for the next layer, evaporate another position of a wire, another insulator, and so on. So, you simply evaporate until you have a block of stuff which has the elements— coils and condensers, transistors and so on—of exceedingly fine dimensions. *
Although real integrated circuits use a few more steps, Feynman gets it essentially correct with the notion of constructing circuits by layering, and that the basic components have no real size limits until you get down to atomic scale.
That said, primitive ICs had been created the year before (1958), and the idea of wiring by evaporating aluminum onto the wafer came in the same year. So I don’t know if this was a genuine prediction or if he just extrapolated from recent news (applying his knowledge that there are no fundamental limits to the process until you get to atoms).